Finetech GmbH & Co. KG

Booth number 2602

Finetech is a manufacturer of innovative sub-micron and high-precision bonders for R&D, prototyping and automated production.

About us

Finetech from Berlin is a manufacturer of innovative sub-micron and high-precision bonders.

The manual, semi-automated and full-automatic systems have a modular design for maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield.

Customers include numerous universities as well as companies from industries such as Data- & Telecom, Industrial Semiconductor, Medical, Automotive, Aerospace, Consumer Electronics as well as Academic and Scientific Research.

Finetech develops tailor-made equipment solutions according to specific requirements.

With sales & service centers in the US, China, Malaysia and Japan, Finetech provides on-site application support and consultation in global core markets.

It is also represented by a worldwide network of representatives.

Finetech GmbH & Co. KG
Boxberger Str. 14
12681 Berlin

Phone: +49 30 9366810

Finetech Shanghai Co. Ltd.
Futexiyi Rd. 355
200131 Shanghai
P.R. China

Phone: +86 21 58661668
Fax: +86 21 58680005

Products and services

Information booth presenting Finetech range of die bonding solutions for R&D, prototyping and production purposes.
FINEPLACER® lambda 2

The new FINEPLACER® lambda 2 sets new standards in precision die attach and advanced chip packaging for opto-electronic assemblie. The completely revised bonding platform can be easily configured for a wide range of applications for process development or prototyping. Due to an ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.

Further reading

FINEPLACER® femto blu

The FINEPLACER® femto blu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability. Designed for prototyping and high-yield production duties, the system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components. Depending on the requirements, the modular system can be individually configured and upgraded in-field to support additional applications and technologies.

Further reading

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