About us

ficonTEC Service GmbH is the world leader in manufacturing of automated assembly, test and inspection equipment for micro-systems, opto-electronic components and photonic devices.

ficonTEC's flexible and scalable machine system options already enable customized assembly and testing solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities from chip level, wafer level and up to module level, particularly in the photonics industry for high power diode lasers (HPDL), LiDAR, telecom and datacom sectors, optical (3D) sensing, microLEDs and fiber laser pump modules.

Products and services

Our machines employ established and industry-recognized assembly technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and optical inspection. ficonTEC also provides a suite of test capabilities for individual components and assembled hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible process control software, the product platforms described below become so much more than just the sum of their parts.

The technologies available to ficonTEC and implemented in both the stand-alone and newer in-line machine platforms translate into a broad and established spectrum of production process capability. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet strict efficiency and yield requirements even for cutting-edge production processes.
AssemblyLine A1200

High-precision, in-line assembly solutions designed for automated production (‘align-&-attach’) of photonic devices. They uniquely combine active alignment capabilities and flexible attachment configurations with a tried and tested software control interface, all in an industry-proven design. Optional modules provide additional features (multi-functionality), with the high-end models providing automatic tool changing, beam testing capability and wafer processing.

Further reading

CustomLine CL2000

Sporting the largest range of optional modules available to any ficonTEC machine system, the CustomLine is our most adaptable and versatile die bonder platform. These machines are designed to provide solutions for customers in the semiconductor and photonics assembly and packaging sector. A variety of configurable functional modules together with clean-room compliance (ISO 6) makes the system an ideal, general-purpose and industry-capable photonic device production cell.

Further reading

FiberLine F300

FiberLine machines are high-precision, fast-active align-&-attach systems ideally suited for fiber-optic and waveguide-based components and devices, including fiber ribbon/arrays and silicon photonics. Various alignment lasers can be configured when attaching fibers to passive optical component such as photodiodes, PLCs, or AWGs. For fiber arrays multiple lasers can be controlled simultaneously. All common fiber connector types are catered to.

Further reading

ficonTEC Service GmbH
Im Finigen 3
28832 Achim

Phone: +49 4202 511600
Internet: www.ficontec.com
E-mail: Send message

Contact person

Alex Cao Zhiqiang
General Manager of ficonTEC China
Phone: +86 21 527 309 85
E-mail: Send message

ficonTEC Service GmbH (Shanghai) Co., Ltd.
Rm. 303, Floor 3, No. 150 Liulin Road
Huangpu District 200021, Shanghai

Phone: +86 21 527 309 85
Internet: www.ficontec.com/cn/
E-mail: Send message

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