Finetech from Berlin is a manufacturer of innovative sub-micron and high-precision bonders. The manual, semi-automated and full-automatic systems have a modular design for maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield.
Customers include numerous universities as well as companies from industries such as Data- & Telecom, Industrial Semiconductor, Medical, Automotive, Aerospace, Consumer Electronics as well as Academic and Scientific Research. Finetech develops tailor-made equipment solutions according to specific requirements.
With sales & service centers in the US, China, Malaysia and Japan, Finetech provides on-site application support and consultation in global core markets. It is also represented by a worldwide network of representatives.
The all-new FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.
The completely revised bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility to protect your investment in the face of ever-changing challenges.
It is a fully-automated die bonder with a placement accuracy of 0.3µm @ 3 sigma that offers unrivaled flexibility for R&D and production environments. Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.
Managing Director Finetech China
Phone: +86 21 58661668
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